Normal view MARC view ISBD view

MEMS packaging /

MEMS packaging / edited by Tai-Ran Hsu - London: Institution of Electrical Engineers, 2004 - xxix, 275 p.: ill.; 26 cm. - EMIS processing series; 3 .

Includes index

Includes bibliographical references

ISBN: 0863413358

Subjects--Topical Terms:
Microelectromechanical systems
Microelectronic packaging

Place hold
Print
Add to your cart (remove)
Save record
BIBTEX Dublin Core MARCXML MARC (non-Unicode/MARC-8) MARC (Unicode/UTF-8) MARC (Unicode/UTF-8, Standard) MODS (XML) RIS ISBD
More searches

Search for this title in:
Other Libraries (WorldCat) Other Databases (Google Scholar) Online Stores (Bookfinder.com) Open Library (openlibrary.org)