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Modeling and simulation for microelectronic packaging assembly : manufacture, reliability, and testing /

Liu, Sheng

Modeling and simulation for microelectronic packaging assembly : manufacture, reliability, and testing / Sheng Liu, Yong Liu - Singapore : Wiley, 2011 - xxii, 564 p. : ill. ; 26 cm.

Includes bibliographical references and index

ISBN: 9780470827802 0470827807

Subjects--Topical Terms:
Microelectronic packaging--Simulation methods

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