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Materials, integration and packaging issues for high-frequency devices : symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A. /

Materials, integration and packaging issues for high-frequency devices : symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A. / editors, P. Muralt ... [et al.] - Warrendale, PA : Materials Research Society, 2004 - xiii, 232 p. : ill. ; 24 cm. - Materials Research Society symposium proceedings ; v. 783 . - Materials Research Society symposia proceedings ; v. 783 .

Includes bibliographical references and indexes

ISBN: 9781558997219 1558997210

Subjects--Topical Terms:
Electronic packaging--Materials--Congresses

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