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Handbook of wafer bonding /

Handbook of wafer bonding / edited by Peter Ramm, James Jian-Qiang Lu, Maaike M.V. Taklo - Weinheim : Wiley-VCH, 2012 - xxxi, 395 p. : ill. (some col.) ; 25 cm.

Includes bibliographical references and index

ISBN: 9783527326464 (hbk.) 3527326464 (hbk.)

Subjects--Topical Terms:
Semiconductor wafers--Handbooks, manuals, etc.
Semiconductors--Bonding--Handbooks, manuals, etc.

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