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Advanced thermal management materials /

Jiang, Guosheng

Advanced thermal management materials / Guosheng Jiang, Liyong Diao, Ken Kuang - New York, NY : Springer, 2013 - xi, 154 p. : ill. ; 24 cm.

Includes bibliographical references and index

ISBN: 9781461419624 (hbk.)

Subjects--Topical Terms:
Microelectronic packaging--Materials--Thermal properties
Microelectronics--Cooling
Heat sinks (Electronics)

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