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SiP-system in package design and simulation : Mentor EE Flow Advanced Design Guide /

Li, Suny,

SiP-system in package design and simulation : Mentor EE Flow Advanced Design Guide / Suny Li - xvii, 477 pages : illusrations ; 25 cm.

Includes bibliographical references and index

ISBN: 9781119045939

Subjects--Topical Terms:
Integrated circuits--Design and construction
Multichip modules (Microelectronics)--Design and construction

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