MARC details
| 000 -LEADER |
| fixed length control field |
02055ntm a2200241 a 4500 |
| 001 - CONTROL NUMBER |
| control field |
vtls000082923 |
| 003 - CONTROL NUMBER IDENTIFIER |
| control field |
KUKTEM |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
| control field |
20251114204535.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
| fixed length control field |
141104s2013 my da f m 000 0 eng|d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
| International Standard Book Number |
THE0007735(Local) |
| 039 #9 - LEVEL OF BIBLIOGRAPHIC CONTROL AND CODING DETAIL [OBSOLETE] |
| Level of rules in bibliographic description |
201905241057 |
| Level of effort used to assign nonsubject heading access points |
fawwaz |
| -- |
201411041037 |
| -- |
training2 |
| 040 ## - CATALOGING SOURCE |
| Original cataloging agency |
UMP |
| 090 ## - LOCALLY ASSIGNED LC-TYPE CALL NUMBER (OCLC); LOCAL CALL NUMBER (RLIN) |
| Classification number (OCLC) (R) ; Classification number, CALL (RLIN) (NR) |
TS590 .Z85 2013 r Bc. |
| 100 1# - MAIN ENTRY--PERSONAL NAME |
| Personal name |
Zulfadly Syazwan Zolkhair |
| 245 10 - TITLE STATEMENT |
| Title |
Different coating type on copper substrate / |
| Statement of responsibility, etc. |
Zulfadly Syazwan Zolkhair |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. |
| Place of publication, distribution, etc. |
Kuantan, Pahang : |
| Name of publisher, distributor, etc. |
UMP, |
| Date of publication, distribution, etc. |
2013 |
| 300 ## - PHYSICAL DESCRIPTION |
| Extent |
xiii, 39 p. : |
| Other physical details |
ill. (some col.) ; |
| Dimensions |
30 cm. + |
| Accompanying material |
1 CD-ROM |
| 502 ## - DISSERTATION NOTE |
| Dissertation note |
Project Paper (Bachelor of Mechanical Engineering (Automotive)) -- Universiti Malaysia Pahang – 2013 |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE |
| Bibliography, etc. note |
Bibliography : p. [40-43] |
| 520 ## - SUMMARY, ETC. |
| Summary, etc. |
This thesis will deal with the effect of different coating types on solder joint strength, specifically on intermetallic compound (IMC). Coating is essential in printed circuit board application since it can protect the base material, which is Copper, from oxidation and degradation. However, the coating thickness will give different effect on solder jointstrength or life. Two types of surface finish have been used in this research which isElectroless Nickel and Electroless Nickel / Immersion Gold (ENIG). The purposes of thesurface finish are to provide a diffusion barrier, oxidation barrier, adhesion and solderablesurface on copper substrate. For this research, solder material that will be used is Sn-4Ag0.5Cu to form a solder joint. All samples were subjected to reflow soldering and then to the isothermal ageing at 150℃ with duration 250 hours and 500 hours. The IMCs werecharacterized using scanning electron microscopy and image analyser to investigate the thickness of IMC on solder joint at all samples. From the research, it was observed that the IMC growth is influenced by ageing duration where the thickness of IMC is increases with ageing. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
Metal Manufactures |