MARC details
| 000 -LEADER |
|---|
| fixed length control field |
02421nam a2200241 a 4500 |
| 001 - CONTROL NUMBER |
|---|
| control field |
vtls000081888 |
| 003 - CONTROL NUMBER IDENTIFIER |
|---|
| control field |
KUKTEM |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
|---|
| control field |
20251117113226.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
|---|
| fixed length control field |
141009t2013 my a f m 000 0 eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
THE0006899(Local) |
| 039 #9 - LEVEL OF BIBLIOGRAPHIC CONTROL AND CODING DETAIL [OBSOLETE] |
|---|
| Level of rules in bibliographic description |
201906131017 |
| Level of effort used to assign nonsubject heading access points |
aida |
| Level of effort used to assign subject headings |
201411051137 |
| Level of effort used to assign classification |
safura |
| -- |
201410091026 |
| -- |
Fida |
| 040 ## - CATALOGING SOURCE |
|---|
| Original cataloging agency |
UMP |
| 090 ## - LOCALLY ASSIGNED LC-TYPE CALL NUMBER (OCLC); LOCAL CALL NUMBER (RLIN) |
|---|
| Classification number (OCLC) (R) ; Classification number, CALL (RLIN) (NR) |
TK7868.P7 A45 2013 r Bc. |
| 100 0# - MAIN ENTRY--PERSONAL NAME |
|---|
| Personal name |
Muhammad Aminuddin Adnan |
| 245 10 - TITLE STATEMENT |
|---|
| Title |
Effect of corrosion on printed circuit board / |
| Statement of responsibility, etc. |
Muhammad Aminuddin Adnan |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. |
|---|
| Place of publication, distribution, etc. |
Kuantan, Pahang : |
| Name of publisher, distributor, etc. |
UMP, |
| Date of publication, distribution, etc. |
2013 |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
xiii, 54 p. : |
| Other physical details |
ill. (some col.) ; |
| Dimensions |
30 cm. + |
| Accompanying material |
1 CD-ROM |
| 502 ## - DISSERTATION NOTE |
|---|
| Dissertation note |
Project paper (Bachelor of Mechanical Engineering (Automotive Engineering)) -- Universiti Malaysia Pahang - 2013 |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE |
|---|
| Bibliography, etc. note |
Bibliography : p.[55-57] |
| 520 3# - SUMMARY, ETC. |
|---|
| Summary, etc. |
Corrosion of electronic systems has been a significant issue in electronic industry nowadays. One of the most common corrosion type is the atmospheric corrosion. Therefore, even a small environmental impact can cause huge damages if the components are not well protected. When the device is in use, the large voltage gradients between points on a printed circuit board (PCBs) will accelerate the corrosion problems dramatically. The complexity of the atmosphere, as corrosion environment, results from atmosphere composition and from presence of some factors as pollutants, temperature, humidity, wind speed and direction. So, the objective of the study is to identify the effect of corrosion on solder joint and copper substrate in 0.5M Sulphuric acid (H2S0) in order to determine the corrosion rate of the substrate in duration time by using weight loss measurement method. Lead-free solder bump were used to form solder joint between lead-free solder Sn-3Ag-0.5Cu (SAC 305) solders with the plated copper substrate. The copper substrate surface finish was deposited by the electroless nickel. The result of study shows the corrosion on the substrate after immersed in 0.5M Sulphuric acid at 168 hours, 336 hours, and 504 hours. The effect of corrosion was increased with the time duration increased. The weight loss data indicated that the thickness of the substrate decreased with the time duration. The structure of the solder joint was analyze using scanning electron microscopy (SEM). |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Printed circuits |