Reverse engineering of mobile phone casing and analysis of weld-line defect / Toh Ban Sheng
Material type:
TextPublication details: Kuantan, Pahang : UMP, 2009Description: xvi, 54 p. : ill. ; 30 cm. + 1 CD-ROMISBN: - THE0007475(Local)
| Item type | Current library | Call number | Copy number | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|---|
Final Year Report
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UMPLIB PEKAN | CD 4232 | TP1150 .T64 2009 rs Bc. (Browse shelf(Opens below)) | 1 | Not for loan | 0000044418 | ||
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Final Year Report
|
UMPLIB PEKAN | TP1150 .T64 2009 rs Bc. (Browse shelf(Opens below)) | 1 | Not for loan | 0000044417 |
Project paper (Bachelor of Mechanical Engineering with Manufacturing Engineering) -- Universiti Malaysia Pahang - 2009
Bibliography : p. [40]-42
In recent decades, reverse engineering (RE) has gradually become important when it comes to the situation that a component must be reproduced but its original engineering data are no longer or not accessible. Sophisticated technologies are introduced for the purpose of reverse engineering. The state-of-the-art technology in latest days is the use of 3D laser scanning with aid of reverse-engineering software to create the 3D geometry model of the existing component. The most appropriate way to duplicate the component is by plastic injection moulding. However, defect such as weld lines always occur during injection moulding process which makes the component aesthetically and structurally unacceptable. Therefore, injection moulding simulation on the component is necessary to investigate the variables that affect the formation of weld lines. Simulations are repetitively done to determine the most optimal variables that remove or reduce weld lines to minimum before the component is ready for reproduction.