Normal view MARC view ISBD view

Optimization of molding parameter effect to warpage and shrinkage based on plastic flow simulation software : handphone casing / Mohd Norhafizi Rohaizat

By:

Mohd Norhafizi Rohaizat

Material type: Text

TextPublication details: Kuantan, Pahang : UMP, 2010Description: xv, 59 p. : ill. (some col.) ; 30 cm. + 1 computer discISBN:

THE0007470(Local)

Other title:

Optimization of molding parameter effect to warpage and shrinkage based on plastic flow simulation software [computer file] handphone casing

Subject(s):

Dissertation note: Project paper (Bachelor of Mechanical Engineering with Manufacturing Engineering) -- Universiti Malaysia Pahang - 2010 Abstract: Injection molding is a manufacturing process for producing part for both thermoplastic and thermosetting plastic material. Objective of this project to determine the parameter effect to the warpage and shrinkage of the handphone casing and to determine the optimization parameter for reduce the warpage and shrinkage. For this project 3D scanner are use to scan the hand phone casing to get the parameter and analyse with MoldFlow simulation software to optimize the effect to warpage and shrinkage. Shrinkage and warpage tendencies in molded parts,are influenced by actions taken in each and all of the manufacturing stages of part design, material selection, tool design, and processing. The mold temperature(MT), packing time (Pt), packing pressure (PP) and cooling time (Ct) in the packing stage are considered as machining parameters. As increase in mold temperature (MT), the shrinkage also increase and as increase in cooling time (Ct), the shrinkage decrease. Other than that, as increase the packing pressure (PP), the shrinkage usually decrease.

Tags from this library: No tags from this library for this title. Log in to add tags.

Average rating: 0.0 (0 votes)

Holdings ( 2 )
Title notes ( 3 )

Holdings
Item type	Current library	Call number	Copy number	Status	Date due	Barcode
Final Year Report	UMPLIB PEKAN	TP1150 .N67 2010 rs Bc. (Browse shelf(Opens below))	1	Not for loan		0000054025
Final Year Report	UMPLIB PEKAN	CD 5028 \| TP1150 .N67 2010 rs Bc. (Browse shelf(Opens below))	1	Not for loan		0000054026

Project paper (Bachelor of Mechanical Engineering with Manufacturing Engineering) -- Universiti Malaysia Pahang - 2010

Bibliography : p. 59

Injection molding is a manufacturing process for producing part for both thermoplastic and thermosetting plastic material. Objective of this project to determine the parameter effect to the warpage and shrinkage of the handphone casing and to determine the optimization parameter for reduce the warpage and shrinkage. For this project 3D scanner are use to scan the hand phone casing to get the parameter and analyse with MoldFlow simulation software to optimize the effect to warpage and shrinkage. Shrinkage and warpage tendencies in molded parts,are influenced by actions taken in each and all of the manufacturing stages of part design, material selection, tool design, and processing. The mold temperature(MT), packing time (Pt), packing pressure (PP) and cooling time (Ct) in the packing stage are considered as machining parameters. As increase in mold temperature (MT), the shrinkage also increase and as increase in cooling time (Ct), the shrinkage decrease. Other than that, as increase the packing pressure (PP), the shrinkage usually decrease.