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Experimental laser-machining of silicon wafer / Lau Zhen Chyen

By:

Lau, Zhen Chyen

Material type: Text

TextPublication details: Kuantan, Pahang : UMP, 2010Description: xv, 85 p. : ill. (some col.) ; 30 cm. + 1 computer discISBN:

THE0006582(Local)

Other title:

Experimental laser-machining of silicon wafer [computer file]

Subject(s):

Dissertation note: Project paper (Bachelor of Mechanical Engineering with Manufacturing Engineering) -- Universiti Malaysia Pahang - 2010 Abstract: This thesis deals with laser machining of silicon wafer at various process parameters. The objective of this thesis is to investigate the effect of laser machining parameters on the cut surface quality and determine the feasible laser machining parameters that can machine silicon wafer. The thesis describes how machining parameters and air assist gas affects cut surface quality. The silicon wafer was machined by laser with and without air assists. Principally, two experimental sets with different cutting speed and laser power were designed in statistical software. The kerf widths and quality were observed under microscopes. The results then were analyzed using statistica software. The analysis indicated that cutting speed has significant effect to the kerf width and laser cutting with air assists produced wider kerf. Result obtained also showed that laser cutting without air assists produced better cut surface quality. The feasible machining parameter of silicon is estimated at 1.0-2.0 mm/min for cutting velocity, 0.80-0.94 watt for laser power in laser cutting without air assist and 1.0-4.0 mm/min for cutting velocity, 0.80-0.90 watt for laser power in laser cutting with air assist.

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Holdings ( 2 )
Title notes ( 3 )

Holdings
Item type	Current library	Call number	Copy number	Status	Date due	Barcode
Final Year Report	UMPLIB PEKAN	TJ1191 .L38 2010 rs Bc. (Browse shelf(Opens below))	1	Not for loan		0000054013
Final Year Report	UMPLIB PEKAN	CD 5022 \| TJ1191 .L38 2010 rs Bc. (Browse shelf(Opens below))	1	Not for loan		0000054014

Project paper (Bachelor of Mechanical Engineering with Manufacturing Engineering) -- Universiti Malaysia Pahang - 2010

Bibliography : p. 52-54

This thesis deals with laser machining of silicon wafer at various process parameters. The objective of this thesis is to investigate the effect of laser machining parameters on the cut surface quality and determine the feasible laser machining parameters that can machine silicon wafer. The thesis describes how machining parameters and air assist gas affects cut surface quality. The silicon wafer was machined by laser with and without air assists. Principally, two experimental sets with different cutting speed and laser power were designed in statistical software. The kerf widths and quality were observed under microscopes. The results then were analyzed using statistica software. The analysis indicated that cutting speed has significant effect to the kerf width and laser cutting with air assists produced wider kerf. Result obtained also showed that laser cutting without air assists produced better cut surface quality. The feasible machining parameter of silicon is estimated at 1.0-2.0 mm/min for cutting velocity, 0.80-0.94 watt for laser power in laser cutting without air assist and 1.0-4.0 mm/min for cutting velocity, 0.80-0.90 watt for laser power in laser cutting with air assist.