An efficient approach for vision inspection of IC chips / Liew Kok Wah

By: Material type: TextTextPublication details: Kuantan, Pahang : UMP, 2012Description: xii, 41 p. : ill. ; 30 cm. + 1 CD-ROMISBN:
  • THE0002938(Local)
Subject(s): Dissertation note: Project paper (Bachelor of Computer Science (Graphics and Multimedia Technology)) - Universiti Malaysia Pahang - 2012 Abstract: The research aims to develop an automated vision inspection system of IC chips that used to detect the defects of marking and design shape of IC chips. As a result of higher failure probability of manual inspection system, this automated system is developed. The automated vision system will consists of five main phases which are image acquisition, image enhancement, image, segmentation, comparison on features and decision making. The features will be extracted from the target image using projection profile method. The decision will be made using the trained neural network to identify the four common defects of IC chips which are illegible marking, upside down marking and missing character on chip. The results of the automated system are to determine whether to accept or reject the chip. The results are computed within 10 seconds and have a high percentage of defects detection which is about 95 %. Through the results obtained, the automated vision inspection system of IC chips can be utilized in the manufacturing field to replace the manual inspection system. It can replace about five to eight inspection experts to reduce the cost of hiring and resources in about 70%. Other than that, the rate of accuracy and efficiency of detecting the defects are improved by 95% because the consistency of inspecting the chips is maintained from having variations of judgments by the experts.
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Item type Current library Call number Copy number Status Date due Barcode
Final Year Report Final Year Report UMPLIB GAMBANG TA1634 .L54 2012 rs Bc. (Browse shelf(Opens below)) 1 Not for loan 0000068739
Final Year Report Final Year Report UMPLIB GAMBANG CD 6551 | TA1634 .L54 2012 rs Bc. (Browse shelf(Opens below)) 1 Not for loan 0000068740

Project paper (Bachelor of Computer Science (Graphics and Multimedia Technology)) - Universiti Malaysia Pahang - 2012

Bibliography : p. 38-39

The research aims to develop an automated vision inspection system of IC chips that used to detect the defects of marking and design shape of IC chips. As a result of higher failure probability of manual inspection system, this automated system is developed. The automated vision system will consists of five main phases which are image acquisition, image enhancement, image, segmentation, comparison on features and decision making. The features will be extracted from the target image using projection profile method. The decision will be made using the trained neural network to identify the four common defects of IC chips which are illegible marking, upside down marking and missing character on chip. The results of the automated system are to determine whether to accept or reject the chip. The results are computed within 10 seconds and have a high percentage of defects detection which is about 95 %. Through the results obtained, the automated vision inspection system of IC chips can be utilized in the manufacturing field to replace the manual inspection system. It can replace about five to eight inspection experts to reduce the cost of hiring and resources in about 70%. Other than that, the rate of accuracy and efficiency of detecting the defects are improved by 95% because the consistency of inspecting the chips is maintained from having variations of judgments by the experts.

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