Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC / Er-Ping Li

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Material type: Text

TextPublication details: Hoboken, NJ : John Wiley & Sons, 2012Description: xiv, 366 p. : ill. ; 25 cmISBN:

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Holdings
Item type	Current library	Call number	Copy number	Status	Date due	Barcode
Open Shelf	UMPLIB PEKAN	TK7874.893 .L54 2012 (Browse shelf(Opens below))	1	Available		0000075313