Power electronic packaging : design, assembly process, reliability and modeling / Yong Liu

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Material type: Text

TextPublication details: New York : Springer, c2012Description: xviii, 591 p. : ill. ; 24 cmISBN:

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Holdings
Item type	Current library	Call number	Copy number	Status	Date due	Barcode
Open Shelf	UMPLIB PEKAN	TK7870.15 .L58 2012 (Browse shelf(Opens below))	1	Available		0000070384

Includes bibliographical references and index