Copper wire bonding / Preeti S. Chauhan... [et al.].

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Material type: Text

TextPublication details: New York (NY) : Springer, 2014Description: xxvi, 235 p. : ill. ; c 24 cmISBN:

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Holdings
Item type	Current library	Call number	Copy number	Status	Date due	Barcode
Open Shelf	UMPLIB PEKAN	TS718 .C67 2014 (Browse shelf(Opens below))	1	Available		0000094620

Includes bibliographical references and index