Assembly and reliability of lead-free solder joints / by John H. Lau, Ning-Cheng Lee

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TextPublisher: Singapore : Springer Singapore : Imprint: Springer, 2020Edition: 1st ed. 2020Description: 1 online resourceContent type:

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Holdings
Item type	Current library	Collection	Call number	Copy number	Status	Date due	Barcode
E-book	UMPLIB PEKAN	Non-fiction	TK7800 .L38 2020 (Browse shelf(Opens below))	1	Available		E000001851