01469nam a2200289 a 4500 vtls000065531 KUKTEM 20251117141325.0 121101t2015 si a f 001 0 eng d 789814327602 (set) 9789814327633 (v.1) 9789814327657 (v.2) 9789814313841 (v.3) 9789814583435 (v.4) 201512281608 saini 201506231518 azli 201211011300 sri UMP Encyclopedia of thermal packaging. Set 2, Thermal packaging tools / editor-in-chief Avram Bar-Cohen Thermal packaging tools Singapore : World Scientific , 2015 4 v. : ill. ; 25 cm. Includes bibliographical references and index v. 1. Cooling of microelectronic and nanoelectronic equipment : advances and emerging research / Madhusudan Iyengar, Karl J. L. Geisler, Bahgat Sammakia -- v. 2. Energy optimization and thermal management of data centers / Bahgat Sammakia ... [et al.] -- v. 3. Compact thermal models of electronic components / Clemens Lasance, Mohammed-Nabil Sabry -- v. 4. Thermally-informed design of microelectronic components / Ankur Srivastava ... [et al.] Electronic packaging Insulation (Heat) Bar-Cohen, Avram, 1946- 0 0 0 1 10000 10000 2019-09-04 4859.95 0 TK7870.15 .E53 2015 re 0000105975 2019-09-04 00:00:00 1 4859.95 2019-09-04 REF v.1 0 0 0 1 10000 10000 2019-09-04 4859.95 0 TK7870.15 .E53 2015 re 0000105974 2019-09-04 00:00:00 1 4859.95 2019-09-04 REF v.2 0 0 0 1 20000 20000 2019-09-04 4859.95 0 TK7870.15 .E53 2015 re 0000105973 2019-09-04 00:00:00 1 4859.95 2019-09-04 REF v.3 0 0 0 1 20000 20000 2019-09-04 4859.95 0 TK7870.15 .E53 2015 re 0000105972 2019-09-04 00:00:00 1 4859.95 2019-09-04 REF v.4 VIRTUA40 14892 14898 VTLSSORT0080*0200*0201*0202*0203*0204*0400*0900*2450*2460*2600*3000*5040*5050*6500*6501*7000*9992