TY  - BOOK
AU  - Bar-Cohen,Avram
TI  - Encyclopedia of thermal packaging
SN  - 789814327602 (set)
PY  - 2015///
CY  - Singapore
PB  - World Scientific
KW  - Electronic packaging
KW  - Insulation (Heat)
N1  - Includes bibliographical references and index; v. 1. Cooling of microelectronic and nanoelectronic equipment : advances and emerging research / Madhusudan Iyengar, Karl J. L. Geisler, Bahgat Sammakia -- v. 2. Energy optimization and thermal management of data centers / Bahgat Sammakia ... [et al.] -- v. 3. Compact thermal models of electronic components / Clemens Lasance, Mohammed-Nabil Sabry -- v. 4. Thermally-informed design of microelectronic components /  Ankur Srivastava ... [et al.]
ER  -