01510nam a2200289 a 4500 vtls000065530 KUKTEM 20251117141343.0 121101t2013 si a f e 001 0 eng d 9789814313780 (set) 9789814313803 (v. 1) 9789814313810 (v. 2) 9789814313827 (v. 3) 9789814313834 (v. 4) 9789814327619 (v. 5) 9789814327626 (v. 6) 201504231531 saini 201211011252 sri UMP Encyclopedia of thermal packaging. Set 1, Thermal packaging techniques / editor-in-chief Avram Bar-Cohen Singapore : World Scientific Pub., 2013 6 v. : ill. ; 25 cm. v. 1. Microchannel heat sinks for electronics cooling / Suresh V. Garimella, Tannaz Harirchian -- v. 2. Air- and liquid-cooled cold plates / Allan Kraus -- v. 3. Dielectric liquid cooling of immersed components / Karl J. L. Geisler. Avram Bar-Cohen -- v. 4. Thermoelectric microcoolers / Bao Yang, Peng Wang -- v. 5. Energy efficienct solid state lighting / Mehmet Arik, Anant Setlur, Stanton E. Weaver Jr., Joseph J. Shiang -- v. 6. Experimental thermofluid characterization of electronic components / Gary L. Solbrekken Electronic packaging Insulation (Heat) Bar-Cohen, Avram, 1946- 0 0 0 1 10000 10000 2019-09-04 5285.77 0 TK7870.15 .E53 2013 re 0000095080 2019-09-04 00:00:00 1 5285.77 2019-09-04 REF v.6 0 0 0 1 10000 10000 2019-09-04 5285.77 0 TK7870.15 .E53 2013 re 0000095081 2019-09-04 00:00:00 1 5285.77 2019-09-04 REF v.5 0 0 0 1 10000 10000 2019-09-04 5285.77 0 TK7870.15 .E53 2013 re 0000095082 2019-09-04 00:00:00 1 5285.77 2019-09-04 REF v.4 0 0 0 1 20000 20000 2019-09-04 5285.77 0 TK7870.15 .E53 2013 re 0000095083 2019-09-04 00:00:00 1 5285.77 2019-09-04 REF v.3 0 0 0 1 20000 20000 2019-09-04 5285.77 0 TK7870.15 .E53 2013 re 0000095084 2019-09-04 00:00:00 1 5285.77 2019-09-04 REF v.2 0 0 0 1 20000 20000 2019-09-04 5285.77 0 TK7870.15 .E53 2013 re 0000095085 2019-09-04 00:00:00 1 5285.77 2019-09-04 REF v.1 VIRTUA40 15358 15364 VTLSSORT0080*0200*0201*0202*0203*0204*0205*0206*0400*0900*2450*2600*3000*5050*6500*6501*7000*9992