Set 1 Thermal packaging techniques Bar-Cohen, Avram 1946- text encyclopedia si Singapore World Scientific Pub. 2013 monographic eng

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6 v. : ill. ; 25 cm. v. 1. Microchannel heat sinks for electronics cooling / Suresh V. Garimella, Tannaz Harirchian -- v. 2. Air- and liquid-cooled cold plates / Allan Kraus -- v. 3. Dielectric liquid cooling of immersed components / Karl J. L. Geisler. Avram Bar-Cohen -- v. 4. Thermoelectric microcoolers / Bao Yang, Peng Wang -- v. 5. Energy efficienct solid state lighting / Mehmet Arik, Anant Setlur, Stanton E. Weaver Jr., Joseph J. Shiang -- v. 6. Experimental thermofluid characterization of electronic components / Gary L. Solbrekken specialized editor-in-chief Avram Bar-Cohen Electronic packaging Insulation (Heat) 9789814313780 (set) 9789814313803 (v. 1) 9789814313810 (v. 2) 9789814313827 (v. 3) 9789814313834 (v. 4) 9789814327619 (v. 5) 9789814327626 (v. 6) UMP 121101 20251117141343.0 vtls000065530