Advanced MEMS packaging  [electronic resource] / 
John H. Lau ... [et al.] 
 - New York :  McGraw-Hill,  c2010 
 - 1 online resource (xxiii, 552 p.) :  ill. 
<br/><br/> Description based on print version record 
<br/><br/>Includes bibliographical references and index 
<br/><br/>Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices 
<br/><br/><br/>Mode of acceess : Internet 
<br/><br/><label>ISBN: </label>9780071627924 (NetLibrary e-ISBN) 0071627928 (NetLibrary e-ISBN) 9780071741835 (McGraw-Hill e-ISBN) 0071741836 (McGraw-Hill e-ISBN) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectromechanical systems<br/>Microelectronic packaging