01550nam a2200313 a 4500001001400000003000700014005001700021006001900038007001500057008004100072020003800113020003500151020003900186020003600225020003100261020002800292040000800320245007900328260003600407300004600443500004600489504005000535505042600585538003101011650003501042650003001077700001701107856011201124vtls000050935KUKTEM20251117141416.0m    f   d        cr cnu---unuuu110110t2010    nyua   fob    001 0 eng d  a9780071627924 (NetLibrary e-ISBN)  a0071627928 (NetLibrary e-ISBN)  a9780071741835 (McGraw-Hill e-ISBN)  a0071741836 (McGraw-Hill e-ISBN)  z9780071626231 (alk. paper)  z0071626239 (alk. paper)  aUMP00aAdvanced MEMS packagingh[electronic resource] /cJohn H. Lau ... [et al.]  aNew York :bMcGraw-Hill,cc2010  a1 online resource (xxiii, 552 p.) :bill.  aDescription based on print version record  aIncludes bibliographical references and index0 aEnabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices  aMode of acceess : Internet 0aMicroelectromechanical systems 0aMicroelectronic packaging1 aLau, John H.403NetLibraryuhttp://www.netlibrary.com.libraryumpsa.idm.oclc.org/urlapi.asp?action=summary&v=1&bookid=291511