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  <titleInfo>
    <title>Advanced MEMS packaging</title>
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  <name type="personal">
    <namePart>Lau, John H.</namePart>
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    <place>
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    <publisher>McGraw-Hill</publisher>
    <dateIssued>c2010</dateIssued>
    <dateIssued encoding="marc">2010</dateIssued>
    <issuance>monographic</issuance>
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  <language>
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  <physicalDescription>
    <form authority="gmd">electronic resource</form>
    <extent>1 online resource (xxiii, 552 p.) : ill.</extent>
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  <tableOfContents>Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices</tableOfContents>
  <targetAudience authority="marctarget">specialized</targetAudience>
  <note type="statement of responsibility">John H. Lau ... [et al.]</note>
  <note>Description based on print version record</note>
  <note>Includes bibliographical references and index</note>
  <note>Mode of acceess : Internet</note>
  <subject authority="lcsh">
    <topic>Microelectromechanical systems</topic>
  </subject>
  <subject authority="lcsh">
    <topic>Microelectronic packaging</topic>
  </subject>
  <identifier type="isbn">9780071627924 (NetLibrary e-ISBN)</identifier>
  <identifier type="isbn">0071627928 (NetLibrary e-ISBN)</identifier>
  <identifier type="isbn">9780071741835 (McGraw-Hill e-ISBN)</identifier>
  <identifier type="isbn">0071741836 (McGraw-Hill e-ISBN)</identifier>
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