02068nam a2200265 a 4500 vtls000045840 KUKTEM 20251114204426.0 100518t2009 my a f m 000 0 engrd THE0007475(Local) 201905161320 fawwaz 201204051142 Fida 201107132320 VLOAD 201005180921 ida 201005180907 ida UMP TP1150 .T64 2009 rs Bc. Toh, Ban Sheng Reverse engineering of mobile phone casing and analysis of weld-line defect / Toh Ban Sheng Kuantan, Pahang : UMP, 2009 xvi, 54 p. : ill. ; 30 cm. + 1 CD-ROM Project paper (Bachelor of Mechanical Engineering with Manufacturing Engineering) -- Universiti Malaysia Pahang - 2009 Bibliography : p. [40]-42 In recent decades, reverse engineering (RE) has gradually become important when it comes to the situation that a component must be reproduced but its original engineering data are no longer or not accessible. Sophisticated technologies are introduced for the purpose of reverse engineering. The state-of-the-art technology in latest days is the use of 3D laser scanning with aid of reverse-engineering software to create the 3D geometry model of the existing component. The most appropriate way to duplicate the component is by plastic injection moulding. However, defect such as weld lines always occur during injection moulding process which makes the component aesthetically and structurally unacceptable. Therefore, injection moulding simulation on the component is necessary to investigate the variables that affect the formation of weld lines. Simulations are repetitively done to determine the most optimal variables that remove or reduce weld lines to minimum before the component is ready for reproduction. Injection molding of plastics Plastics Moulding Reverse engineering 0 0 0 1 20000 20000 2019-09-04 0 CD 4232 | TP1150 .T64 2009 rs Bc. 0000044418 2019-09-04 00:00:00 1 2019-09-04 PSM 0 0 0 1 20000 20000 2019-09-04 0 TP1150 .T64 2009 rs Bc. 0000044417 2019-09-04 00:00:00 1 2019-09-04 PSM VIRTUA40 1807 1813 VTLSSORT0080*0200*0400*0900*1000*2450*2600*3000*5020*5040*5200*6500*6501*6502*9992