MEMS packaging / 
edited by Tai-Ran Hsu 
 - London:    Institution of Electrical Engineers,   2004 
 - xxix, 275 p.:   ill.;   26 cm. 
 - EMIS processing series; 3 .
<br/><br/> Includes index 
<br/><br/>Includes bibliographical references 
<br/><br/><label>ISBN: </label>0863413358 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectromechanical systems<br/>Microelectronic packaging