TY  - BOOK
AU  - Ariff Syakirin Ghazalli
TI  - Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures
SN  - THE0006900(Local)
PY  - 2007///
CY  - Kuantan, Pahang
PB  - UMP
KW  - Solder and soldering
KW  - Printed circuits
N1  - Project paper (Bachelor of Mechanical Engineering) -- Universiti Malaysia Pahang - 2007
ER  -