02880nam a2200265 a 4500001001400000003000700014005001700021008004100038020002200079039010800101040000800209090002800217100001900245245007600264246007700340260003400417300005900451502009200510520162900602650002702231952012202258952013202380999002502512999007702537vtls000040716KUKTEM20251114204453.0090722t2008    my ao  f m    000 0 eng d  aTHE0006651(Local) 9a201905161514bamirulc201905161513damirulc201107132155dVLOADc200908141650dVLOADy200907221754zkam  aUMP  aTJ1280 .T38 2008 rs Bc.0 aTaufif Zakaria10aDedicated fixture design for polishing of silicon /cTaufif Bin Zakaria3 aDedicated fixture design for polishing of siliconh[electronic resource]  aKuantan, Pahang :bUMP,c2008  a45 p. :bill. (some col.) ;c30 cm. +e1 computer disc  aProject paper (Bachelor of Mechanical Engineering) -- Universiti Malaysia Pahang - 20083 aPolishing of silicon is a major process seen in microelectronic and optical industries. As mirror-like surface finish is an essential factor that influences the performance of electronic and optical products,  it has been believed that the fixture in finite element does play a role to produce such a quality surface on silicon. This paper centers on designing the fixture in finite element environment for polishing of silicon. Polishing process was virtually developed using general  purpose FE codes. Process   model consist of major components needed for polishing such as the base plate, the pad, the abrasive, silicon and of course of fixture. Currently only 2D model was considered because of the complexity of the process and limitation of the FE code. Fixed diamond abrasive proposed by VTT microelectronics was created in FE model to overcome the modeling difficulty of loose abrasives, to conveniently define polishing forces involved, and also investigated the effectiveness of the new abrasive design. Polishing forces were split into two-normal and tangential forces. The presence of micron-size diamond abrasive was modeled by defining friction coefficient at the interface between silicon and abrasive sheet. Typical values of polishing forces were defined as recommended by   manufacturer. Finer mesh was designed at  the top layer of the silicon in order to simulate the action of the diamond abrasive realistically. Polishing process was simulated by changing the various fixture designs. The goodness of the fixture design was justified by absence of high stress concentration in anywhere in the silicon. 0aGrinding and polishing  00104071a20000b20000d2019-09-04l0oTJ1280 .T38 2008 rs Bc.p0000038190r2019-09-04 00:00:00t1w2019-09-04yPSM  00104071a20000b20000d2019-09-04l0oCD 3448 | TJ1280 .T38 2008 rs Bc.p0000038191r2019-09-04 00:00:00t1w2019-09-04yPSM  aVIRTUA40c2587d2593  aVTLSSORT0080*0200*0400*0900*1000*2450*2460*2600*3000*5020*5200*6500*9992