TY  - BOOK
AU  - Cognard,Philippe
TI  - Adhesives and sealants: basic concepts and high tech bonding 
SN  - 0080445543 (hbk.)
PY  - 2005///
CY  - Amsterdam, San Diego, CA, Oxford
PB  - Elsevier
KW  - Adhesives
KW  - Sealing compounds
ER  -