Thermal management of microelectronic equipment : heat transfer theory, analysis methods, and design practices /
L.T. Yeh, R.C. Chu
- New York : ASME Press, c2002
- xxi, 414 p. : ill. ; 24 cm.
- ASME Press book series on electronic packaging .
Includes bibliographical references and index
0791801683
Electronic apparatus and appliances--Cooling Electronic apparatus and appliances--Thermal properties Heat--Transmission