TY  - BOOK
ED  - EMAP
TI  - Proceeding of the 6th International Conference on Electronic Materials and Packaging (EMAP 2004), December 5-7, 2006 Penang, Malaysia
SN  - 983251486X
PY  - 2004///
CY  - Penang, Malaysia
PB  - IEEE CPMT
KW  - Electronics
KW  - Materials
ER  -