Harman, George G. <br/><br/>
Wire bonding in microelectronics / 
George G. Harmon 
 - 3rd ed. 
 - New York :  McGraw-Hill,  2010 
 - xx, 426 p. :  ill. ;  24 cm. +  1 CD-ROM 
<br/><br/>Includes bibliographical references and index 
<br/><br/><label>ISBN: </label>9780071476232 0071476237 9780071701013 (hbk.) 007170101X (hbk.) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Wire bonding (Electronic packaging)--Production control<br/>Electronic packaging--Reliability<br/>Electronic packaging--Defects<br/>Semiconductors--Failures