01083nam a2200301 a 4500 vtls000056160 KUKTEM 20251117144511.0 111121t2010 nyua f 001 0 eng d 9780071476232 0071476237 9780071701013 (hbk.) 007170101X (hbk.) 201202161529 asmadi 201111211138 sri 201111211135 sri 201111211132 sri UMP TK7836 .H37 2010 Harman, George G. Wire bonding in microelectronics / George G. Harmon 3rd ed. New York : McGraw-Hill, 2010 xx, 426 p. : ill. ; 24 cm. + 1 CD-ROM Includes bibliographical references and index Wire bonding (Electronic packaging) Production control Electronic packaging Reliability Electronic packaging Defects Semiconductors Failures 0 0 0 0 20000 20000 2019-09-04 273.11 0 TK7836 .H37 2010 0000062750 2019-09-04 00:00:00 1 273.11 2019-09-04 OPEN 0 0 0 0 20000 20000 2019-09-04 273.11 0 CD 5784 | TK7836 .H37 2010 0000062751 2019-09-04 00:00:00 1 273.11 2019-09-04 ACCOM VIRTUA40 37594 37600 VTLSSORT0080*0200*0201*0202*0203*0400*0900*1000*2450*2500*2600*3000*5040*6500*6501*6502*6503*9991