TY  - BOOK
AU  - McKerrow,Andrew J.
ED  - Advanced Metallization Conference
ED  - University of California, Berkeley.
TI  - Advanced Metallization Conference 2007 (AMC 2007): proceedings of the conference held October 9-11, 2007, in Albany, New York, U.S.A. and October 9-11, 2007, at University of Tokyo, Tokyo, Japan. This Conference is MRS affiliated and sponsored by Continuing Education in Engineering, University Extension, University of California at Berkeley, California, U.S.A. 
T2  - Materials Research Society conference proceedings
SN  - 9781558999923
PY  - 2008///
CY  - Warrendale, Pa.
PB  - Materials Research Society
KW  - Semiconductors
KW  - Design and construction
KW  - Congresses
KW  - Integrated circuits
KW  - Ultra large scale integration
KW  - Materials
KW  - Thin films
KW  - Metallic films
KW  - Metallizing
N1  - Includes bibliographical references and indexes
ER  -