TY  - BOOK
AU  - Brongersma,Sywert H.
ED  - Advanced Metallization Conference
ED  - University of California, Berkeley.
TI  - Advanced Metallization Conference 2005 (AMC 2005): proceedings of the conference held September 27-29, 2005, in Colorado Springs, Colorado, U.S.A., and October 13-14, 2005, University of Tokyo, Tokyo, Japan 
T2  - Materials Research Society conference proceedings
SN  - 9781558998650
PY  - 2006///
CY  - Warrendale, Pa.
PB  - Materials Research Society
KW  - Semiconductors
KW  - Design and construction
KW  - Congresses
KW  - Integrated circuits
KW  - Ultra large scale integration
KW  - Materials
KW  - Thin films
KW  - Metallic films
KW  - Metallizing
N1  - "This conference is MRS affiliated and sponsored by Continuing Education in Engineering, University Extension, University of California at Berkeley, California, U.S.A."; Includes bibliographical references and indexes
ER  -