02029nam a2200373 a 4500001001400000003000700014005001700021008004100038020001800079020001500097039007100112040000800183090002400191111003800215245026000253246001300513260005800526300003400584490005400618500017300672504005200845650005600897650009200953650007801045650002701123650003101150650002801181700002601209710007701235830005401312952013501366999002701501999012701528vtls000060022KUKTEM20251117145452.0120522t2006    paua     b    101 0 eng d  a9781558998650  a1558998659 9a201710021127bAUTHORITYc201211281601dfauziy201205221522zsafura  aUMP  aTK7871.85 .A38 20062 aAdvanced Metallization Conference10aAdvanced Metallization Conference 2005 (AMC 2005) :bproceedings of the conference held September 27-29, 2005, in Colorado Springs, Colorado, U.S.A., and October 13-14, 2005, University of Tokyo, Tokyo, Japan /ceditors, Sywert H. Brongersma  ... [et al.]30aAMC 2005  aWarrendale, Pa. :bMaterials Research Society,cc2006  axxv, 755 p. :bill. ;c24 cm.1 aMaterials Research Society conference proceedings  a"This conference is MRS affiliated and sponsored by Continuing Education in Engineering, University Extension, University of California at Berkeley, California, U.S.A."  aIncludes bibliographical references and indexes 0aSemiconductorsxDesign and constructionvCongresses 0aIntegrated circuitsxUltra large scale integrationxDesign and constructionvCongresses 0aIntegrated circuitsxUltra large scale integrationxMaterialsvCongresses 0aThin filmsvCongresses 0aMetallic filmsvCongresses 0aMetallizingvCongresses1 aBrongersma, Sywert H.2 aUniversity of California, Berkeley.bContinuing Education in Engineering 0aMaterials Research Society conference proceedings  00104070a20000b20000d2019-09-04g107.07l0oTK7871.85 .A38 2006p0000068299r2019-09-04 00:00:00t1v107.07w2019-09-04yOPEN  aVIRTUA40c46886d46892  aVTLSSORT0080*0200*0201*0400*0900*1110*2450*2460*2600*3000*4900*5000*5040*6500*6501*6502*6503*6504*6505*7000*7100*8300*9992