02722nam a2200277 a 4500 vtls000057356 KUKTEM 20251117145550.0 111213t2011 nyua f 001 0 eng d 9780071741958 201204061532 asmadi 201112131535 irma UMP TK7874.893 .A14 2011 3D IC stacking technology / Banqiu Wu, Ajay Kumar, Sesh Ramaswami, editors New York : McGraw-Hill Professional, 2011 xviii, 521 p. : ill. (chiefly col.) ; 24 cm. Includes bibliographical references and index "The latest advances in three-dimensional integrated circuit stacking technology 3D IC Stacking Technology is a comprehensive resource on three-dimensional stacking technology, including scientific theory, processing methods, applications, and an overview of the industry’s technological future. The book is targeted to semiconductor engineers and portable device designers. The quality and functional capabilities of nearly all of today’s electronic devices and the production lines that produce them are dependent on key internal semiconductor components--ICs. Lithography and packaging integration are the determining factors in keeping pace with the electronics industry’s quest to have more and more transistors on chip product by shrinking ICs and other related products, or by stacking the multiple chips into one chip device. This in-depth volume covers these cutting-edge technologies. 3D IC Stacking Technology Focuses on industrial applications Includes detailed fabrication processes Covers a separate fabrication step in each chapter, written by an industry expert Provides a one-stop knowledge resource for 3D IC technology Discusses future applications and device design potentials Comprehensive coverage: Design challenges; Process sequence integration; TSV etch; Chemical vapor; Barrier/ seed deposition; ECD fill; Chemical mechanical polishing; Wafer thinning; Temporary and permanent bonding; Cost of ownership"-- Provided by publisher "This pioneering work explores three-dimensional integrated circuit stacking technology which allows for more transistors on a chip and benefits portable electronics device design with smaller-scale IC, lower power consumption, less heat generation, extended battery life, and lower costs of operation"-- Provided by publisher Three-dimensional integrated circuits Microelectronic packaging Wu, Banqiu Kumar, Ajay Ramaswami, Sesh 0 0 0 0 10000 10000 2019-09-04 379.53 0 TK7874.893 .A14 2011 0000064376 2019-09-04 00:00:00 1 379.53 2019-09-04 OPEN VIRTUA40 48904 48910 VTLSSORT0080*0200*0400*0900*2450*2600*3000*5040*5200*5201*6500*6501*7000*7001*7002*9991