02174ntm a2200253 a 4500 vtls000083177 KUKTEM 20251117113231.0 141106t2013 my a f m 000 0 eng d THE0004896(Local) 201905131242 SHAHRILJ 201412101245 Fida 201411061055 Fida UMP TP968 .B35 2013 r Bc. Balqis Adam Development of natural adhesive using lignin and soy protein / Balqis Adam Kuantan, Pahang : UMP, 2013 xiii, 52 p. : ill. ; 30 cm. + 1 CD-ROM Project paper (Bachelor of Chemical Engineering) -- Universiti Malaysia Pahang - 2013 Bibliography : p. 39-40 Adhesive are indispensable component in wood composite which is directly affect its physical, mechanical and chemical properties which are classified into two categories as synthetic and natural adhesive. By experiencing the emission of formaldehyde vapors which are carcinogenic of synthetic based adhesive, the natural adhesives in market be competitive, however they were weak in bonding and water resistance. As to overcome the problem this study attempts to develop natural adhesive that contain environmental friendly material by using lignin and soy protein, study its bonding strength and water resistant ability by chemically modify the protein to make the composite boards can pass the physical and mechanical tests of the medium density fiberboard (MDF). Therefore, the modification of soy flour with different concentration of lignin had been formulated by adding other chemical such as sodium hydroxide as alkali solution to the formulation to reach the required properties of strength and water resistance. As s conclusion, from this study it was found that only internal bonding give the good result and can be acceptable. In addition, high bonding strength and good water resistance of adhesive can be achieved by some additional modification of soy protein and lignin. Adhesives Adhesion 0 0 0 1 10000 10000 2019-09-04 0 CD 8427 | TP968 .B35 2013 r Bc. 0000090004 2019-09-04 00:00:00 1 2019-09-04 PSM 0 0 0 1 10000 10000 2019-09-04 0 TP968 .B35 2013 r Bc. 0000090003 2019-09-04 00:00:00 1 2019-09-04 PSM VIRTUA40 5139 5145 VTLSSORT0080*0200*0400*0900*1000*2450*2600*3000*5020*5040*5200*6500*6501*9992