TY  - BOOK
AU  - Ho,Paul S.
ED  - Materials Research Society
TI  - Electronic packaging materials science VI: symposium held April 27-30, 1992, San Francisco, California, U.S.A. 
T2  - Materials Research Society symposium proceedings
SN  - 9781558991590
PY  - 1992///
CY  - Pittsburgh, PA
PB  - Materials Research Society
KW  - Electronic packaging
KW  - Congresses
KW  - Materials
N1  - Includes bibliographical references and index
ER  -