TY  - BOOK
AU  - Li,Yi
AU  - Lu,Daniel
AU  - Wong,C.P.
TI  - Electrical conductive adhesives with nanotechnologies
SN  - 9780387887821
PY  - 2009///
CY  - New York, NY
PB  - Springer
KW  - Electronic packaging
KW  - Solder and solder
KW  - Adhesives
KW  - Electric properties
KW  - Nanostructured materials
N1  - Includes bibliographical references and index
ER  -