TY  - BOOK
AU  - Rodbell,Kenneth P.
TI  - Materials reliability in microelectronics III: symposium held April 12-15, 1993, San Francisco, California, U.S.A. 
T2  - Materials Research Society symposium proceedings
SN  - 9781558992054
PY  - 1993///
CY  - Pittsburgh, PA
PB  - Materials Research Society
KW  - Microelectronics
KW  - Reliability
KW  - Congresses
KW  - Materials
KW  - Testing
KW  - Electrodiffusion
KW  - Microstructure
N1  - Includes bibliographical references and index
ER  -