Liu, Sheng <br/><br/>
Modeling and simulation for microelectronic packaging assembly :  manufacture, reliability, and testing / 
Sheng Liu, Yong Liu 
 - Singapore :  Wiley,  2011 
 - xxii, 564 p. :  ill. ;  26 cm. 
<br/><br/>Includes bibliographical references and index 
<br/><br/><label>ISBN: </label>9780470827802 0470827807 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packaging--Simulation methods