TY  - BOOK
AU  - Liu,Sheng
AU  - Liu,Yong
TI  - Modeling and simulation for microelectronic packaging assembly: manufacture, reliability, and testing 
SN  - 9780470827802
PY  - 2011///
CY  - Singapore
PB  - Wiley
KW  - Microelectronic packaging
KW  - Simulation methods
N1  - Includes bibliographical references and index
ER  -