01095nam a2200277 a 4500 vtls000066867 KUKTEM 20251125093324.0 121126t2011 ne a f b 001 0 eng d 9781437778892 201306171216 jamie 201306171215 jamie 201306171214 jamie 201211261436 farina UMP TK7871 .L53 2011 Licari, James J. Adhesives technology for electronic applications : materials, processing, reliability / James J. Licari and Dale W. Swanson 2nd ed. Amsterdam, Netherlands : William Andrew Pub., c2011 Materials and processes for electronic applications series Includes bibliographical references and index Electronics Materials Adhesives Electronic packaging Swanson, Dale W. Materials and processes for electronic applications series 0 0 0 0 20000 20000 2019-09-04 588.32 0 TK7871 .L53 2011 0000073490 2019-09-04 00:00:00 1 588.32 2019-09-04 OPEN VIRTUA40 63606 63612 VTLSSORT0080*0200*0400*0900*1000*2450*2600*3000*4900*5040*6500*6501*6502*7000*8300*9992