01397nam a2200277 a 4500001001400000003000700014005001700021008004100038020001800079020001500097040000800112245041300120260005800533300003400591490003900625504005200664650009200716650003000808650004400838650002800882650003300910700002600943700001900969710007700988830005401065vtls000059950KUKTEM20251125093351.0120522t1996    paua   f b    001 0 eng d  a9781558993419  a155899341X  aUMP00aAdvanced metallization and interconnect systems for ULSI applications in 1995 :bproceedings of the conference held October 3-5, 1995 in Portland, Oregon, sponsored by Continuing Education in Engineering, University Extension, University of California at Berkeley, U.S.A., a parallel session of the conference was held from October 24- 25, 1995 in Tokyo, Japan /ceditors, Russell C. Ellwanger, Shi-Qing Wang  aPittsburgh, Pa. :bMaterials Research Society,cc1996  axix, 767 p. :bill. ;c24 cm.1 aConference proceedings,x1048-0854  aIncludes bibliographical references and indexes 0aIntegrated circuitsxUltra large scale integrationxDesign and constructionvCongresses 0aVapor-platingvCongresses 0aElectrochemical metallizingvCongresses 0aDielectricsvCongresses 0aTitanium nitridevCongresses1 aEllwanger, Russell C.1 aWang, Shi-Qing2 aUniversity of California, Berkeley.bContinuing Education in Engineering 0aMaterials Research Society conference proceedings