01545nam a2200301 a 4500001001400000003000700014005001700021008004100038020001800079020001500097040000800112111003800120245038200158246001300540260005800553300003500611490006600646504005200712650005600764650007800820650009200898650002700990650003101017650002801048700002401076710007701100830006601177vtls000060000KUKTEM20251125093413.0120522t2002    paua   f b    101 0 eng d  a9781558996700  a1558996702  aUMP2 aAdvanced Metallization Conference10aAdvanced Metallization Conference 2001 (AMC 2001) :bproceedings of the conference held October 8-11, 2001, in Montreal, Canada, sponsored by Continuing Education in Engineering, University Extension, University of California at Berkeley, California, U.S.A. A parallel session of the conference was held October 29-31 in Tokyo, Japan. /ceditors, Andrew J. McKerrow ... [et al]30aAMC 2001  aWarrendale, Pa. :bMaterials Research Society,cc2002  axxii, 719 p. :bill. ;c24 cm.1 aMaterials Research Society conference proceedings,x1048-0854  aIncludes bibliographical references and indexes 0aSemiconductorsxDesign and constructionvCongresses 0aIntegrated circuitsxUltra large scale integrationxMaterialsvCongresses 0aIntegrated circuitsxUltra large scale integrationxDesign and constructionvCongresses 0aThin filmsvCongresses 0aMetallic filmsvCongresses 0aMetallizingvCongresses1 aMcKerrow, Andrew J.2 aUniversity of California, Berkeley.bContinuing Education in Engineering 0aMaterials Research Society conference proceedings,x1048-0854