01423nam a2200265 a 4500001001400000003000700014005001700021008004100038020001800079020001500097040000800112245043100120260005800551300003600609490003900645504005200684650009200736650007800828650003000906650004400936650002800980700001801008710007701026830005401103vtls000059969KUKTEM20251125093413.0120522t1998    paua   f b    101 0 eng d  a9781558994126  a1558994122  aUMP00aAdvanced metallization and interconnect systems for ULSI applications in 1997 :bproceedings of the conference held September 30-October 2,1997, in San Diego, California, sponsored by Continuing Education in Engineering, University Extension, University of California at Berkeley, California, U.S.A., a parallel session of the conference was held from October 21-22, 1997, in Tokyo, Japan /ceditors, Robin Cheung ... [et al.]  aWarrendale, Pa. :bMaterials Research Society,cc1998  axviii, 765 p. :bill. ;c24 cm.1 aConference proceedings,x1048-0854  aIncludes bibliographical references and indexes 0aIntegrated circuitsxUltra large scale integrationxDesign and constructionxCongresses 0aIntegrated circuitsxUltra large scale integrationxMaterialsxCongresses 0aVapor-platingxCongresses 0aElectrochemical metallizingxCongresses 0aDielectricsxCongresses1 aCheung, Robin2 aUniversity of California, Berkeley.bContinuing Education in Engineering 0aMaterials Research Society conference proceedings