TY  - BOOK
AU  - Cheung,Robin
ED  - University of California, Berkeley.
TI  - Advanced metallization and interconnect systems for ULSI applications in 1997: proceedings of the conference held September 30-October 2,1997, in San Diego, California, sponsored by Continuing Education in Engineering, University Extension, University of California at Berkeley, California, U.S.A., a parallel session of the conference was held from October 21-22, 1997, in Tokyo, Japan 
T2  - Conference proceedings,
SN  - 9781558994126
PY  - 1998///
CY  - Warrendale, Pa.
PB  - Materials Research Society
KW  - Integrated circuits
KW  - Ultra large scale integration
KW  - Design and construction
KW  - Congresses
KW  - Materials
KW  - Vapor-plating
KW  - Electrochemical metallizing
KW  - Dielectrics
N1  - Includes bibliographical references and indexes
ER  -