Li, Er-Ping <br/><br/>
Electrical modeling and design for 3D integration :  3D integrated circuits and packaging signal integrity, power integrity, and EMC / 
Er-Ping Li 
 - Hoboken, NJ :  John Wiley & Sons,  2012 
 - xiv, 366 p. :  ill. ;  25 cm. 
<br/><br/><label>ISBN: </label>9780470623466 (hardback) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Three-dimensional integrated circuits<br/>TECHNOLOGY & ENGINEERING / Electronics / Circuits / VLSI & ULSI.