01425nam a2200253 a 4500001001400000003000700014005001700021008004100038020003000079040000800109245010100117260005100218300003400269490005400303504005000357505057700407650003300984650004101017650002701058650002801085700002001113700002001133700001801153vtls000061849KUKTEM20251125093556.0120613t2012    enka   f      001 0 eng d  a9781107003781  (hardback)  aUMP00aLCP for microwave packages and modules /cedited by Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara  aCambridge :bCambridge University Press,c2012  axiv, 253 p. :bill. ;c26 cm.0 aThe Cambridge RF and microwave engineering series  aIncludes bibliographical references and index8 aMachine generated contents note: 1. Introduction; 2. Characteristics of liquid crystal polymer (LCP) Morgan J. Chen, Kunia Aihara, Cheng Chen and Anh-Vu H. Pham; 3. Fabrication techniques for processing LCP laminates; 4. LCP for wafer level chip scale MEMS; 5. LCP for surface mount interconnects, packages, and modules; 6. LCP for passive components Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 7. LCP for system design Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 8. LCP reliability 0aMicrowave devicesxMaterials 0aMicroelectronic packagingxMaterials 0aLiquid crystal devices 0aPolymer liquid crystals1 aPham, Anh-Vu H.1 aChen, Morgan J.1 aAihara, Kunia