01669nam a2200301 a 4500 vtls000061849 KUKTEM 20251125093556.0 120613t2012 enka f 001 0 eng d 9781107003781 (hardback) 201304041615 saini 201206131230 safura UMP TK7876 .L37 2012 LCP for microwave packages and modules / edited by Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara Cambridge : Cambridge University Press, 2012 xiv, 253 p. : ill. ; 26 cm. The Cambridge RF and microwave engineering series Includes bibliographical references and index Machine generated contents note: 1. Introduction; 2. Characteristics of liquid crystal polymer (LCP) Morgan J. Chen, Kunia Aihara, Cheng Chen and Anh-Vu H. Pham; 3. Fabrication techniques for processing LCP laminates; 4. LCP for wafer level chip scale MEMS; 5. LCP for surface mount interconnects, packages, and modules; 6. LCP for passive components Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 7. LCP for system design Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 8. LCP reliability Microwave devices Materials Microelectronic packaging Materials Liquid crystal devices Polymer liquid crystals Pham, Anh-Vu H. Chen, Morgan J. Aihara, Kunia 0 0 0 0 20000 20000 2019-09-04 355.79 0 TK7876 .L37 2012 0000071775 2019-09-04 00:00:00 1 355.79 2019-09-04 OPEN VIRTUA40 66009 66015 VTLSSORT0080*0200*0400*0900*2450*2600*3000*4900*5040*5050*6500*6501*6502*6503*7000*7001*7002*9992